Automotive SPICE® for Cybersecurity
Part I: Process Reference and Assessment Model for Cybersecurity Engineering,
Part II: Rating Guidelines on Process Performance (Level 1) for Cybersecurity Engineering,
1st edition, August 2021
Automotive SPICE Guidelines. Process assessment using the Automotive SPICE PAM 4.0. Assessor Edition (wire-o binding). 2nd revised edition, November 2023
EOS-Electrical Overstress in the Automotive Industry, Dealing with semiconductor devices showing a signature of electrial overstress, Contents, documentations and explanations, 1st Edition, January 20