Automotive SPICE® for Cybersecurity. Part I: Process Reference and Assessment Model for Cybersecurity Engineering. Part II: Rating Guidelines on Process Performance (Level 1) for Cybersecurity Engineering, 2nd edition, March 2025
Automotive SPICE Guidelines. Process assessment using the Automotive SPICE PAM 4.0. Assessor Edition (wire-o binding). 2nd revised edition, November 2023
Automotive SPICE Potential Analysis, Process Reference and Assessment Model based on Automotive SPICE® and Automotive SPICE® for Cybersecurity including Guidelines, 1st Edition, August 2024
EOS-Electrical Overstress in the Automotive Industry, Dealing with semiconductor devices showing a signature of electrial overstress, Contents, documentations and explanations, 1st Edition, January 20